Kellen Haile Fixed Equipment Engineer at ExxonMobil Bucknell University, 2018, B.S. Mechanical Engineering Kellen Haile Fixed Equipment Engineer at ExxonMobil Bucknell University, 2018, B.S. Mechanical Engineering
Kendall K. Belcher Structural Engineer for Kiewit Infrastructure Engineers Louisiana Tech University, 2013. B.S. Civil Engineering w/Minor in Business Administration Kendall K. Belcher Structural Engineer for Kiewit Infrastructure Engineers Louisiana Tech University, 2013. B.S. Civil Engineering w/Minor in Business Administration
Kerri Devine Engineering Manager and Program Manager at Siemens Smart Infrastructure Duke University, 2013, B.S.E. Electrical & Computer Engineering and B.S. Computer Science w/Certificate in Energy & Environment Kerri Devine Engineering Manager and Program Manager at Siemens Smart Infrastructure Duke University, 2013, B.S.E. Electrical & Computer Engineering and B.S. Computer Science w/Certificate in Energy & Environment
Kerry Muenchow Materials and Process Engineer at Pratt & Whitney Worcester Polytechnic Institute, 2019, B.S. Chemical Engineering Kerry Muenchow Materials and Process Engineer at Pratt & Whitney Worcester Polytechnic Institute, 2019, B.S. Chemical Engineering
Kevin Jiang RF/mmWave Engineer & Systems Engineer at a 5G Wireless Startup University of Southern California, 2018, B.S. Electrical Engineering Kevin Jiang RF/mmWave Engineer & Systems Engineer at a 5G Wireless Startup University of Southern California, 2018, B.S. Electrical Engineering
Kevin Simon PhD Student, MIT and Co-Founder, Khethworks Olin College of Engineering, 2012, B.S. Mechanical Engineering Kevin Simon PhD Student, MIT and Co-Founder, Khethworks Olin College of Engineering, 2012, B.S. Mechanical Engineering
Kurt Paterson Department Head, Engineering James Madison University Kurt Paterson Department Head, Engineering James Madison University Email: paterskg@diamax.com Phone: +1 540.568.8110
Kushal Seetharam PhD Student, MIT Duke University, 2014, B.S. Electrical and Computer Engineering Kushal Seetharam PhD Student, MIT Duke University, 2014, B.S. Electrical and Computer Engineering
Kushal Seetharam Student, Massachusetts Institute of Technology, GCSP Scholar Kushal Seetharam Student, Massachusetts Institute of Technology, GCSP Scholar
Kwasi Amofa PhD Student at UC Berkeley/UCSF Graduate Program in Bioengineering Western New England University, 2017, B.S. Biomedical Engineering Kwasi Amofa PhD Student at UC Berkeley/UCSF Graduate Program in Bioengineering Western New England University, 2017, B.S. Biomedical Engineering
Landen McDonald Post-Bachelor’s Research Associate at Oak Ridge National Laboratory University of Tennessee, Knoxville, 2019, B.S. Mechanical Engineering Landen McDonald Post-Bachelor’s Research Associate at Oak Ridge National Laboratory University of Tennessee, Knoxville, 2019, B.S. Mechanical Engineering
Lauren Froschauer Mechanical Engineer at Northrop Grumman Olin College of Engineering, 2016, B.S. Mechanical Engineering Lauren Froschauer Mechanical Engineer at Northrop Grumman Olin College of Engineering, 2016, B.S. Mechanical Engineering
Lauren Pudvan MS in Electrical and Computer Engineering at Northeastern University Olin College of Engineering, 2019, Electrical and Computer Engineering Lauren Pudvan MS in Electrical and Computer Engineering at Northeastern University Olin College of Engineering, 2019, Electrical and Computer Engineering
Leidy Klotz GCSP Director Leidy Klotz GCSP Director Email: lk6me@diamax.com Phone: +1 610.247.9067 Website: http://www.arch.virginia.edu/faculty/node/2593
Leland Weiss PhD Associate Professor, Mechanical Engineering Thurman Lauret Professor; Director: Tech Grand Challenge Scholars Program Louisiana Tech University Leland Weiss PhD Associate Professor, Mechanical Engineering Thurman Lauret Professor; Director: Tech Grand Challenge Scholars Program Louisiana Tech University Email: lweiss@diamax.com Phone: +1 318.257.5113
Li Yingtao President The 2012 Laboratories, Huawei Technologies Co. Ltd Li Yingtao President The 2012 Laboratories, Huawei Technologies Co. Ltd
